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Ciss-Input Capacitance : 25pF@15V
Operating Temperature : -65℃~+200℃@(Tj)
Pd - Power Dissipation : 500mW
FET Type : -
Drain Current (Idss) : 15mA@15V
RDS(on) : 100Ω
Gate-Source Breakdown Voltage (Vgss) : 30V
Gate-Source Cutoff Voltage (VGS(off)) : 3V@1nA
Description : 500mW 15mA@15V 100Ω 30V SMD-3P JFETs RoHS
Mfr. Part # : MX2N5115UB/TR
Model Number : MX2N5115UB/TR
Package : SMD-3P
This low-profile surface mount P-CHANNEL J-FET is available in military equivalents for high-reliability applications. It offers a low-profile ceramic surface mount package and is RoHS compliant in commercial grade versions. Screening in reference to MIL-PRF-19500 is available.
| Model | Gate-Source Breakdown Voltage (V(BR)GSS) | Drain-Source "On" State Voltage (VDS(on)) @ ID = -15 mA | Gate Reverse Current (IGSS) @ VDS = 0, VGS = 20 V | Drain Current Cutoff (ID(off)) @ VGS = 12 V | Zero Gate Voltage Drain Current (IDSS) @ VGS = 0, VDS = -15V | Gate-Source Cutoff (VGS(off)) @ VDS = -15, ID = -1.0 nA | Small-Signal Drain-Source "On" State Resistance (rds(on)1) @ VGS = 0, ID = -1.0 mA | Small-Signal Drain-Source "On" State Resistance (rds(on)2) @ VGS = 0, ID = 0; f = 1 kHz | Small-Signal Reverse Transfer Capacitance (Crss) | Small-Signal Input Capacitance (Ciss) | Turn-On Delay Time (Td(on)) | Rise Time (tr) | Turn-Off Delay Time (Td(off)) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 2N5114UB | 30 V | -1.3 V | 500 pA | -500 pA | -30 mA | 5.0 V | 75 | 75 | 7.0 pF | 25 pF | 6 s | 10 s | 6 s |
| 2N5115UB | 30 V | -0.8 V | 500 pA | -500 pA | -15 mA | 3.0 V | 100 | 100 | 7.0 pF | 25 pF | 10 s | 20 s | 8 s |
| 2N5116UB | 30 V | -0.6 V | 500 pA | -500 pA | -5.0 mA | 1.0 V | 175 | 175 | 7.0 pF | 27 pF | 25 s | 35 s | 20 s |
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MICROCHIP MX2N5115UBTR P Channel J FET with Low Gate Source Breakdown Voltage and High Drain Current Images |